Call for Papers

Call for Papers

Conference Tracks

Submit a Paper

The 2026 2nd International Conference on Emerging Trends in Engineering and Computing (ETECOM 2026) is a premier event, uniting researchers, professionals, and students to explore the latest advancements in engineering and computing. The conference serves as a platform to share innovative research, foster collaboration, and discuss emerging trends shaping the future of these fields. The conference will be hosted by the ENSTA Paris (École Nationale Supérieure de Techniques Avancées) on the 26th and 27th of October 2026. ENSTA Paris is a top-tier French grande école specializing in engineering, founded in 1741 and located in Palaiseau (Paris-Saclay). You are invited to submit your papers, which should be made on EDAS (https://edas.info/N35157) in the topics not limited to the tracks below:

Track 1: Artificial Intelligence, Machine Learning, and Cybersecurity

  • Deep learning, foundation models, generative AI, and large language models
  • Reinforcement, federated, and distributed learning
  • Natural language processing, computer vision, and multimodal analytics
  • Explainable, interpretable, and trustworthy AI; adversarial and secure ML
  • AI-driven optimization and decision-support systems
  • Cybersecurity, threat intelligence, intrusion detection, and digital forensics
  • Data privacy, protection, fraud/anomaly detection, and trust management
  • AI applications across science, industry, and healthcare
  • AI ethics, governance, and regulation

Track 2: Data Science, Data Analytics, Digital Twins, and Business Analytics

  • Data science methods, big data analytics, and scalable data processing
  • Predictive, prescriptive, and descriptive analytics; data mining and knowledge discovery
  • Data visualization, visual analytics, and time-series forecasting
  • Financial, risk, marketing, and operations analytics methods
  • Smart city and urban data intelligence
  • Digital twin modeling, simulation, and optimization (manufacturing, infrastructure, healthcare)
  • Data governance, quality, integration, and interoperability
  • Privacy-preserving analytics

Track 3: Communication Systems, Networking, and Cloud Computing

  • Next-generation wireless, 5G/6G and beyond, and future Internet architectures
  • Green, sustainable, and energy-efficient communication systems
  • Optical, fiber-optic, MIMO, and millimeter-wave communications
  • Cognitive radio, dynamic spectrum access, and AI-enabled self-optimizing networks
  • Software-defined networking (SDN), NFV, and network slicing
  • Cloud computing models, cloud-native networking, and service orchestration
  • Edge-cloud continuum, QoS/QoE, and sustainable data centers
  • Security, privacy, and trust in communication networks

Track 4: Internet of Things, Smart Sensing, Smart Grids & Smart Energy, and Edge Computing

  • IoT architectures, protocols, and interoperability
  • Networked smart sensing systems and wireless sensor networks
  • Industrial IoT (Industry 4.0), smart homes, cities, and environments
  • IoT security, privacy, and trust management
  • Smart grids, smart energy systems, and energy informatics
  • Renewable integration, microgrids, demand response, and V2G energy systems
  • Cloud, fog, and edge computing for IoT; edge AI and real-time edge processing
  • Internet of Vehicles (V2X), cyber-physical systems, and connected-environment digital twins

Track 5: Electronics, Circuits, and Systems

  • Analog, digital, and mixed-signal circuit design
  • VLSI, SoC/SiP, and microelectronics/semiconductor devices
  • Embedded systems, reconfigurable computing, and FPGA-based design
  • Hardware accelerators for AI, neuromorphic, and edge computing
  • Sensors, sensor electronics, instrumentation, and MEMS/NEMS microsystems
  • Power electronics, RF/microwave, and photonic/optoelectronic devices
  • Low-power, wearable, flexible, and printed electronics
  • Hardware security, test, reliability, and fault tolerance

Track 6: Smart Civil & Architectural Engineering, Intelligent Transportation Systems, and GIS

  • Smart construction materials, intelligent infrastructure, and BIM/digital construction
  • Smart, green, and sustainable buildings and architecture
  • Structural health monitoring and resilient urban infrastructure
  • Intelligent transportation systems, smart mobility, and traffic optimization
  • Autonomous and connected vehicles (autonomy and driving systems)
  • Urban planning, transportation planning, and mobility analytics
  • GIS, geospatial technologies, spatial/spatiotemporal analysis, and remote sensing
  • Geospatial big data, disaster management, and environmental monitoring

Track 7: Mechanical, Industrial, and Robotics Engineering

  • Advanced manufacturing, smart factories, and Industry 4.0/5.0
  • Additive manufacturing, 3D printing, and digital/cyber-physical production
  • Industrial automation, process optimization, and predictive maintenance
  • Robotics: perception, planning, control, collaboration, and human–robot interaction
  • Mechatronics, mechanical system design, and computational mechanics
  • Thermal systems, renewable energy systems, and energy storage/optimization
  • Operations research, supply chain, logistics, and quality/reliability engineering
  • Advanced materials, sustainable production, and human factors/ergonomics

Track 8: Digital Transformation in Education, Business, Management & Finance

  • Digital transformation strategies, frameworks, and innovation management
  • Technology-enhanced, adaptive, and personalized learning; learning management systems
  • AI in education and instructional design for digital learning
  • Accessible, inclusive learning and ethical/responsible AI use in education
  • Digital business models, process automation, and enterprise transformation
  • Digital platforms, e-commerce, and FinTech/digital banking innovation
  • Blockchain in business and finance; intelligent decision-making and business intelligence
  • Digital governance, risk/compliance, ESG/sustainability, and digital entrepreneurship